Extrusion Technology announces the renaming of the company to CBT technology

October 3, 2011 Randolph, MA

Extrusion Technology Inc. announces the renaming of the company to CBT Technology Inc. to better reflect our company’s market, product, and customer needs. Per Reinhold Hesse, President and CEO, “Our goal is to align the company name with our overall market and sales focus which is to be THE GLOBAL SOURCE for front panels, enclosures, and ruggedized packaging -all technologies associated with mechanical solutions for circuit boards and electronics.”

“Going forward our future depends on innovation - through new products, new capabilities, and new services. Growth will come through our commitment to addressing our customer’s' needs for products and services through collaboration, understanding, and support - in other words - through Customer Intimacy.” highlighted Reinhold.

“Moving beyond extruded technologies is a major step for us,” , comments Laurie Burger, Chief Marketing Officer, “ and embraces many of the new capabilities of the company. With the acquisition of Triple E and Purcell over the past 2 years - we have now positioned CBT Technology for growth as a full service global front panel and enclosure supplier.”

CBT will strive to maintain Product Leadership with our innovation-focused “out of the box” mindset. Per Laurie Burger, “On the new product front - we are excited about the new VPX toolbox of ruggedized components for the military/aerospace industries, and the addition of IP rated and EMC enclosure solutions for a wide range of general electronics applications. New products are a cornerstone of the strategy for future growth.”

CBT will continue to focus on innovative ways to leverage our newly expanded global manufacturing capabilities and design and applications engineering competencies. Our commitment is to demonstrate operational excellence via a passion for simplicity, FLOW, teamwork, and relentless continuous improvement .

The launch of the new CBT Technology name is an important step in our journey. We have included an FAQ at the end of this letter - with immediate details on how the company renaming impacts you. We also request you visit our new website at www.cbttechnology.com for additional information.

If you have any questions/concerns - do not hesitate to contact either Jeff Snyder or myself.

Our contact information is noted below:

Laurie Burger
Chief Marketing Officer
Email: lburger@cbttechnology.com

Jeff Snyder
Marketing Officer Director of Global Sales and Customer Relations
Email: jsnyder@cbttechnology.com

Extrusion Technology Acquires Purcell Technologies

February 4,2011 Randolph, MA

Extrusion Technology, parent company of the XTech and Triple E brands, today announced the acquisition of Purcell Technologies, Inc. of Brentwood, California.

"The acquisition of Purcell enables us to continue the expansion of our Front Panel capabilities – both domestically and globally," said Reinhold Hesse, President of Extrusion Technology. "Purcell has a strong reputation for quality and service, with a focus on Front Panel and Bracket products. The acquisition reinforces our leadership position as The Front Panel Source.".

Supported by a world class manufacturing operation in China, Purcell provides front panel and bracket solutions to a wide range of top tier OEM's in telecommunications, datacom, and general electronics markets.

The acquisition of Purcell adds new products and services to the Extrusion Technology portfolio, including extractor/ejectors, PC Brackets, and extensive sheet metal fabrication and die cast front panel capabilities. In addition – the Extrusion Technology sales channel (including our e-commerce site - XTECH Direct) and extrusion capabilities will complement the Purcell offering. For more information, visit www.cbttechnology.com and www.purcelltech.com.

About Extrusion Technology

Extrusion Technology offers the Triple E and XTech brand products, featuring a broad array of front panel and enclosure solutions for ruggedized and commercial applications. With facilities in Randolph, MA and Xiamen, China, Extrusion Technology offers customers Custom and open architecture front panel solutions including CPCI, VME, ATCA, and AMC, as well as a range of aluminum enclosures, custom extrusions, and ruggedized card cages.

Contact:
Laurie Burger
Chief Marketing Officer
Extrusion Technology Inc
Tel 781-963-7200
Email: lburger@cbttechnology.com

ETI to Attend RTECC in Santa Clara, 1/27/11

January 24, 2011

Randolph, MA & Santa Clara, CA—XTech/Triple E will be participating in the Real Time Embedded Computing Conference in Santa Clara, CA on January 27th, 2011.

Stop by and meet with Nancy Cole, the ETI Western Regional Manager, and O'Donnell Associates North for an overview of the latest in ruggedized and high performance front panel and enclosure solutions.

You can register online here and walk the floor show for free. For additional information, please visit the RTECC Santa Clara page.

To see other trade shows ETI will be attending, visit our Trade Show page.

Contact:
Laurie Burger, Chief Marketing Officer
Call 1-888-333-1644 or email us at sales@cbttechnology.com.

Triple E 901 series ieee1101.10 card guide drawings available for download

January 12, 2011

Triple E announces the availability of engineering drawings downloads for their 901 series card guides. Drawings are available in both 3-dimensional STP format and the universal PDF format.

To download a drawing click here

Laurie Burger 
Chief Marketing Officer 
Extrusion Technology

XTech and Triple E VPX Handle Solutions, from COTS to Ruggedized

November 11, 2010, Randolph, MA — XTech and Triple E, the leaders in front panel solutions, today announced the industry’s broadest line of VPX front panel ejector solutions. The options from XTech and Triple E offer a wide selection price/performance features, including:

• All-metal solutions and hybrid designs
• For COTS requirements — such as test and measurement, ground based applications, and communications equipment — a hybrid solution provides metal teeth to lock securely to the rail, combined with a cost effective plastic body.
• For more ruggedized applications, e.g., where shock and vibration are a key consideration, all-metal handles deliver high performance and reliability.

XTech Chief Marketing Officer Laurie Burger said, “Through XTech XPress, our full range of quick turn modification services also provide customized and assembled front panels for our customers’ boards. The combined solutions from XTech and Triple E represent the most comprehensive family of VPX front panels and ejectors in the industry.”

COTS components, including handles and front panel hardware, may be purchased directly at XTech’s online store, XTech Direct. XTech XPress services are available to quickly turn customer ideas into finished products. Detailed drawings, data sheets and more information on all-metal solutions are available on the Triple E website. Solutions consultation and sales assistance is available by email at sales@cbttechnology.com or by phone at 1-888-444-1644.

About XTech
XTech is the Global leader in front panel solutions. XTech front panel and enclosures are used widely throughout the communications, enterprise/networking, security/defense, healthcare, and electronics industries.  The company maintains manufacturing and sales/support operations in Randolph, MA, and Xiamen, China.

About Triple E
Triple E ruggedized extractors, front panels, chassis, and enclosures are used widely throughout the security/defense, transportation, and electronics industries.

Contact:
Laurie Burger, Chief Marketing Officer
lburger@cbttechnology.com
781-300-2410
www.cbttechnology.com

TRIPLE E ANNOUNCES ITAR (INTERNATIONAL TRADE IN ARMS REGULATIONS) COMPLIANCE

Randolph, MA — May 7th, 2010 — Triple E, Randolph, MA — Triple E, the leading global manufacturer of ruggedized front panels and enclosures for the defense/security and electronics industries, announced that the firm's Randolph, Massachusetts facility has met the stringent requirements of the ITAR Compliance program.

Having registered with the Directorate of Defense Trade Controls of the U.S. Department of State, XTech has met stipulations pertaining to organization structure, documentation, corporate policy, training and procedures. XTech is certified to independently handle, use and transfer information controlled by the ITAR (International Trade in Arms Regulations) and the U.S. Munitions list. "Complying with the ITAR Compliance Program provides significant value to our customers in the defense and security markets.

Defense is a growth segment for Triple E products, and by investing in regulatory policies and control, we are committed to being a valued supply chain partner to the military and aerospace industries, " said Laurie Burger, ETI Chief Marketing Officer. About Triple E Triple E is a subsidiary of Extrusion Technology Inc. (ETI) and is an innovative and leading manufacturer of ruggedized electronic packaging solutions

The Company is headquartered in Randolph, Massachusetts. Triple E ruggedized extractors, front panels, chassis, and enclosures are used widely throughout the security/defense, transportation, and electronics industries. Extrusion Technology Inc. is privately held.

Contact:
Laurie Burger, Chief Marketing Officer
781-963-7200, ext. 210
lburger@cbttechnology.com

XTech Acquires Triple E Corporation

Randolph, MA — February 19, 2010 — XTech (www.cbttechnology.com), the leading global manufacturer of front panels and accessories for the electronics industry, today announced that it has acquired TripleE Corporation, in Lowell, Massachusetts. TripleE provides ruggedized solutions to the defense, avionics, and security industries.

"This acquisition reflects XTech's strategy of expanding and diversifying into markets that are adjacent to our core front panel and enclosure business," said Reinhold Hesse, Chief Executive Officer. "The growth rates of the defense/security markets are attractive and stable, with long product life cycles. TripleE complements XTech's current base of business in the communications and general electronics markets — where shorter life cycles are common."

"The addition of TripleE also presents an exciting opportunity to leverage the disciplines of XTech's strong Lean manufacturing team. We will continue to implement performance improvements and drive bottom line growth by applying XTech's proven continuous improvement processes."

TripleE will become part of Extrusion Technology, Inc., the parent company of the XTech brand. Laurie Burger, Chief Marketing Officer, noted, "The acquisition will broaden our market share in the defense sector, while opening up new opportunities for organic growth through synergies in channel, products, and global manufacturing footprint. Given XTech's ITAR compliance — a key requirement in the defense and security sectors — we can more easily and seamlessly integrate TripleE into XTech's infrastructure. Our current and new customers are foremost on our minds and our transition team is taking all precaution to ensure success."

"TripleE's strong portfolio of ruggedized front panels and components — for applications such as NEBS compliant systems and mobile communications — greatly enhances XTech's offerings to the telecommunications and computing markets. The acquisition expands our ability to serve the rapidly growing needs of those applications," Burger added.

"XTech reinforces its commitment to customer service, product quality and innovation to the ruggedized market through this acquisition," said Reinhold Hesse. "We are excited by the opportunities we see to innovate and grow."

Contact:
Laurie Burger, Chief Marketing Officer
781-963-7200, ext. 210
lburger@cbttechnology.com

Triple E Corporation Offers Aluminum Solution To Problem of Plastic Card Guides Breaking or Flexing

LOWELL, MA --Triple E Corporation, a leading supplier of electronic enclosure systems, EuroCage sub-racks and Front Panels for VMEbus, VXIbus, CompactPCI and other open architecture platforms, introduces unbreakable aluminum replacement card guides for IEEE1101.10 guide decks. The ideal solution for high shock and vibration military, industrial and commercial applications, Triple*Easeä 901 Series guides, interchangeable with most plastic guides, are available in 1, 2, 3 or 4 slot clusters. Versions are available for all standard VME board depths from 60mm to 400mm. M3.5 or 6-32 machine screws securely attach the clusters to front and rear tie bar rails.

With a Lifetime Warranty against breakage, fully assembled guide decks featuring these patented guide clusters are also available. In addition to the standard aluminum inject/eject front lip, there is also a stainless steel option for very high force applications. 901 Series guide decks also feature anti-rotation front and rear tie bar rails with two 8-32 screws at each end.

Guide clusters and guide decks are available from stock in many standard configurations.

Triple E Corporation Offers Aluminum Solution To Problem of Broken Plastic Front Panel Ejector Handles

LOWELL, MA --Triple E Corporation, a leading supplier of electronic enclosure systems, EuroCage sub-racks and Front Panels for VMEbus, VXIbus, CompactPCI and other open architecture platforms, introduces unbreakable aluminum replacement handles for standard and shielded Front Panels. The ultimate solution for fully ejecting PCB's from high pin count backplane connectors, TripleEase aluminum handles provide twice the cam travel of plastic handles and won't break, bend, out-gas, melt or burn.

With a Lifetime Warranty against breakage, these single cam extruded aluminum handles are a direct replacement for plastic handles from other suppliers. Triple E single cam ejector handles provide a quick, simple and cost effective way to solve the problem of handle breakage on existing front panel designs. There is no need to modify hardware or change engineering drawings. To determine the correct TripleEase replacement handle style just measure the width of the cam slot in the front panel. For narrow cam slot applications (slot = 3.6mm/0.142") specify handle kit part number EJS-VM-N-X4-X4-B2. For wide cam slot applications (slot = 4.75mm/0.187") specify handle kit part number EJS-VM-W-X4-X4-B2.

Handle kits are available from stock and are price competitive with plastic.

Rugged Euro-cage enclosure designed for critical applications

LOWELL, MA -- Triple E Corporation's new powered enclosure incorporates innovative structural features for superior performance and improved durability in critical military and aerospace applications. The new design meets current IEEE1101.10/IEEE1101.11 specifications, MIL-Specs for shock/vibration and EIA/IEC rack mount standards.The D+1600 Series enclosure features solid aluminum construction to provide structural integrity and increased protection of boards under rigorous use. A stainless steel inject/eject plate available only from Triple E provides up to 104 lbs of insertion/extraction force, withstanding unlimited injection/ejection cycles of boards with high connector pin counts. The patented extruded aluminum card guide system will not flex or break like plastic and maximizes cooling airflow between the card guides. An all aluminum housing with powder coat finish and stainless steel hardware ensures superior durability in harsh environments.

Models D+1605 and D+1607 accommodate up to five (5) or seven (7) horizontal mount 6U 4HP boards respectively. Both models include ball bearing fans, an auto-ranging power supply and either a VME64X or cPCI backplane. Options include desktop or rack mount style, front mount drive bays, rear mounted 80mm I/O plug-in unit, choice of power supply up to 500W. Tower version also available. Additionally, standard or custom TripleEase front panels are available with choice of handle assembly style.

MAXAIR.10™ Enclosure Solves Inject/Eject Board Problems

LOWELL, MA -- Triple E Corporation's new MaxAir.10™ enclosure features a stainless steel inject/eject plate, significantly increasing performance in applications where high connector pin count and numerous inject/eject cycles compromise traditional aluminum plates. The stainless steel inject/eject plate provides superior durability where connector pin counts exceed 616 pins, requiring 462N (104 lbs) insertion force. Replacement plate upgrades are easy in existing Triple E Corporation's IEEE1101.10 card frames.

The exclusive design of the MaxAir.10™ ensures high reliability performance in military, aerospace and telecommunication applications. A patented extruded aluminum cardframe system provides maximum cooling airflow between slot positions and is cost competitive with less-durable molded plastic cardframe systems. All aluminum housings with powder coat finish and stainless steel hardware eliminate potential heat damage, ensuring durability in harsh environments. The enclosure is designed to IEEE1101.10 specifications, MIL-Specs for shock/vibration and EIA/IEC rack mount standards.

Enclosures are sized in fractional or whole U-heights from 1U to 22U. Card frame widths range from 4HP (.8-in.) to 110HP (22-in.) with flexible card spacing and depth/height divisions without losing part or full slot position in standard width cardframes. Card frames are manufactured for either 1.6mm (.062) or 2.4mm (.093) card thickness.

Engineered options to suit specific customer application requirements include ESD, card edge grounding clips, and rear transition card attachment sections in 60mm card depth and larger. A variety of color and textured powder coat finishes are available, including chemical film conversion for electrically conductive surfaces.

Card Cage Front Panel Provides Uniform Extraction of Multiple Boards

LOWELL, MA -- Triple E Corporation introduces the new Triple*Ease™ VME Quad-Cam ejector handle designed to allow straight and full removal of two or more PCB boards from the backplane without damage.

The double and triple wide extruded aluminum panels feature patented EZ-Mount™  integral PCB mounts to ensure increased stability during insertion and removal of boards. Machined to fit customer specifications, special panel mounts attach to PCB boards with a single screw.

Quad-cam handle assemblies are solid aluminum, rather than plastic, eliminating possible breakage due to increased extraction force load associated with multiple boards. Handles achieve 0.2-in. of cam travel with a separate large stainless steel pivot pin.

Double (8HP, 1.6-in.) and triple (12HP, 2.4-in.) wide panels are available in standard heights of 3U (5.25-in.), 6U (10.5-in.), 9U (15.75-in.) and 12U (21.0-in.). An independent bracket and stainless steel dowel ensure a perfect fit between the panel and handle, resulting in even handle alignment for a streamlined finish. Standard panels feature durable scratch resistant powder coat finish with radiused edges and silkscreening

Triple E's advanced manufacturing capabilities offer engineered options to meet customer specifications including; standard and custom panel sizes with machined holes and cut outs, PCB mountings, EMI/RFI shielding, ID labels, finishes, etc.

Hi-leverage Handle Provides Easy Removal of Circuit Assemblies

LOWELL, MA -- Triple E Corporation's new Triple*Ease™ VME ejector handle more than doubles extraction force for easy removal of circuit assemblies from a 9U backplane. The patented high-leverage handle design ensures safe and secure disengagement of high density connectors without warpage or damage to large PC boards.

The solid aluminum extrusion handle minimizes the possibility of breakage during removal of boards. Handles are secured with a separate large stainless steel pivot pin, rather than a traditional PCB mounting screw. Twin cam construction reduces torque and allows for 0.2-in. cam travel. The low profile handle lies flush on the front panel providing a streamlined appearance.

Standard front panels require no assembly and are available in 4HP (0.8-in.), 8HP (1.6-in.) and 12HP (2.4-in.) in heights of 3U (5.25-in.), 6U (10.5-in.), 9U (15.75-in.) and 12U (21.0-in.). EZ-Mount™ PCB mounts are integral to the panel extrusion for increased stability during insertion and removal of large boards. PCB mounts are provided where needed, optimizing surface area for connectors, LED's and switches. Special panel mounts, machined to fit customer specifications, attach to PC boards with a single screw. Panels feature durable scratch resistant powder coat finish with radiused edges and silkscreening.

Triple E's advanced manufacturing capabilities offer engineered options to meet customer specifications including; standard and custom panel sizes with machined holes and cut outs, PCB mountings, EMI/RFI shielding, ID labels, and finishes. Panels meet IEEE, DIN and IEC mechanical specs, supporting VMEbus, VXIbus and CompactPCI bus architectures.

Unbreakable Handle for CPCI and VME64x Front Panels

LOWELL, MA -- Triple E Corporation's patented solid aluminum handle assembly with stainless steel leaf spring will not wear out, warp, break, outgas or burn like conventional plastic handles. The revolutionary design meets the new IEEE 1101.10 specifications for cPCI and VME64 bus extension applications, and is ideal for rugged COTS requirements. 

The unique inject/eject handle retains a true U-height in the open position, allowing for stacking of units. The extrusion design allows fabrication of any desired single handle widths over 4HP. Extruded aluminum front panels provide a rugged and stable mounting surface for one or more large boards. Patented integral PCB EZ-Mount™ ensures secure attachment of the panel to board, preventing warpage or damage during insertion and removal. 

Shielded panels feature EMC gaskets with continuous contact, eliminating electro-magnetic leakage from flat spots or gaps. Gaskets of conductive elastomer or spiral stainless steel hold up to rigorous wear, saving maintenance repair costs for dents or bent fingers associated with traditional gaskets. 

Standard panels arrive totally assembled to prevent lost parts, and include machined holes and cutouts, PCB mountings, EMI/RFI shielding, and Lexan ID labels. A durable powder coat finish with radiused edges and silk-screening is suitable for harsh environments and will not chip, stain or scratch. 

Panel sizes include 3U(5.25-in.), 6U(10.5-in.) and 9U(15.75-in.) in single (4HP), double (8HP), or triple (12HP) widths. Many engineered options are available to suit customer specifications.

Triple E is Proud to Announce an All Extruded Aluminum Card Cage Design

LOWELL, MA -- This concept, the first of its kind, provides a durable, ruggedized assembly that features an extruded panel of card guides. These card guides are spaced and sized according to the specific bus structure, such as VMEbus, VXIbus or cPCIbus.

Very effective cooling can be accomplished with uninterrupted airflow through punched openings between the card guide slots.

Extremely efficient for conducting and removing heat from a crowded environment, this all-aluminum cage also eliminates the problem of flexing and breakage. Plastic card guides will bend over a short distance allowing vibration and misalignment.

The side plates are assembled to each rail with stainless steel screws, which are paired to help insure rigidity of the assembly.

Not only durable but also beautiful, these card cages are also a first to feature an epoxy powder coating. This coating gives the card cage assembly a beautiful uniform textured finish. This finish is non-conductive and is highly resistant to chipping and scratching.

• Meet industry standards for VME, VXI and cPCI.
• Designed to meet UL, CSA, TUV and FCC requirements. 
• Can be fabricated to suit customer requirements. 
• Card Cage with Backplane assembly is available - consult factory. We can also supply a fully wired powered rack assembly, including power supply and cooling fans. 

Note: Our Triple E Card Cage has been satisfactorily tested for shock and vibration. Consult factory for complete report.

New Sub-racks Offer Maximum Air Flow and Ruggedness

LOWELL, MA -- A new MAX-AIR Series of Euro-Cage Sub-racks has been introduced by Triple E Corp. Continuing the tradition of ruggedly durable all-extruded aluminum construction pioneered and patented by Triple E, the MaxAir™ Series features a new card guide/rail assembly which provides up to 20% lower forced air back pressure as compared to competitive models with plastic card guides.

Aluminum card guides also provide better heat transfer and eliminate the problems of flexing and breaking found with plastic guides. The new sub-racks are flame proof and extremely rugged, making them ideal for industrial and military environments.

Integrated with Triple*Ease™ front panels, MaxAir™ provides your product with an attractive finished appearance and the ruggedness to withstand almost any environment. Available as fully assembled sub-racks (not just a kit of loose parts) or with optional back planes, power supplies, fan trays, and/or EMI/RFI shielding.

Competitively priced, the new MaxAir™ sub-racks can be produced to meet the specifications of all major bus architectures including VME, VXI and cPCI.

Fully EMI/RFI Shielded VME Sub-racks

LOWELL, MA - Shielded versions of Standard and MaxAir™ Series Sub-racks have been introduced by Triple E Corp. Designed to be used with Triple* Ease™ EMI/RFI Front Panels, the patented all-extruded aluminum sub-racks now offer EMI/RFI shielding designed to meet requirements of FCC Part 15 Class A/B and VDE 0871 Class A/B.

Perforated aluminum top and bottom sub-rack covers allow cooling air flow and are bonded electrically to provide EMI/RFI shielding. A solid 80dB Shielding Effectiveness is provided from 100MHz through 10GHz per Mil-G-83528, paragraph 4.6.12.

In addition to VME64x the new EMI/RFI Shielded Sub-racks can be produced to meet cPCI and VXI requirements. Furnished fully assembled, Triple E sub-racks can also be custom fabricated to suit virtually any application requirement. Optional back planes, power supplies, and fan trays are also available.

New E+PLUS Series of VME Powered Enclosures with Extruded Aluminum Card Guides and Optimum Cooling

LOWELL, MA - Three new VME Powered Enclosures in the E+PLUS Series have been introduced by Triple E Corp. Available in Desk Top and Rack Mount versions, the new enclosures feature MaxAir™ sub-racks with patented solid aluminum card guides, a low pressure drop forced air cooling system, and durable powder coat finish.

Now available are Models E+1605 and E+1607 which accommodate up to 5 and up to 7 horizontal mount VME 6U4HP boards respectively. Model E+2612 accommodates up to 12 vertical mount VME boards. Vertical mount sub-racks up to 21 slots wide may be specified in the E+2600 Series.

All E+PLUS Series Enclosures feature J1/J2 Monolithic Backplanes, ball bearing fans, up to 750W Switching Power Supply, Optional front and/or internal mount Drive Bays, optional rear mounted I/O module, and smooth or texture powder coat finish.

Integrated with Triple*Ease™ front panels, E+PLUS powered enclosures provide your product with an attractive finished appearance and the ruggedness to withstand almost any environment.